Dell, one of the world’s largest server makers, has spilled the beans on Nvidia’s upcoming AI GPUs, codenamed Blackwell. Apparently, these processors will consume up to 1000 Watts, a 40% increase in power over the prior-gen, requiring Dell to use its engineering ingenuity to cool these GPUs down. Dell’s comments might also hint at some of the architectural peculiarities of Nvidia’s upcoming compute GPUs.
“Obviously, any line of sight to changes that we are excited about what’s happening with the H200 and its performance improvement,” said Yvonne Mcgill, Dell’s chief financial officer. “We are excited about what happens at the B100 and the B200, and we think that’s where there’s actually another opportunity to distinguish engineering confidence. Our characterization in the thermal side, you really don’t need direct liquid cooling to get to the energy density of 1,000 watts per GPU.”
| Tom’s Hardware | Nvidia H100 (current) | Nvidia B100 (Dell est.) | AMD MI300X | Nvidia H200 (current) |
| FP16/bf16 TFLOPS | 989 | ? | 1307 | 989 |
| Power Consumption | 700W | 1000W | 750W | 700W |
| Die Size (sq mm) | 814 | ? | 1017 | 814 |
Being unaware of Nvidia’s plans regarding its Blackwell architecture, we can only refer to the basic rule of thumb with heat dissipation, which says that thermal dissipation typically tops out around 1W per square millimeter of the chip die area.
This is where it becomes interesting from a chip manufacturing point of view: Nvidia’s H100 (being built on a custom 4nm-class process technology) already dissipates around 700W, albeit with the power of HBM memory included, and the chip die is 814^2 large, so it falls under 1W per square millimeter. This die is built on a TSMC custom performance-enhanced 4nm-class process technology.
Nvidia’s next-generation GPU will probably be built on another performance-enhanced process technology, and we can only guess that it will be built with a 3nm-class process technology. Given the amount of power the chip consumes, and the required thermal dissipation, its rational to think that Nvidia’s B100 might be a dual-die design, the company’s first, thus allowing it to have a larger surface area to deal with the the heat generated. We’ve already seen AMD and Intel adopt GPU architectures with multiple dies, so this would track with other industry trends.
When it comes to high-performance AI and HPC applications, we need to consider the performance measured in FLOPS and the power it takes to achieve these FLOPS and cool the resulting thermal energy. What matters for software developers is how to use those FLOPS efficiently. What matters for hardware developers is how to cool the processors producing those FLOPS. This is where Dell says its technologies are poised to exceed the company’s rivals, which is why Dell’s CFO spoke out about Nvidia’s next-generation Blackwell GPUs.
“That happens next year with the B200,” said McGill, referring to Nvidia’s next AI and HPC GPU. “The opportunity for us really to showcase our engineering and how fast we can move and the work that we’ve done as an industry leader to bring our expertise to make liquid cooling perform at scale, whether that’s things in fluid chemistry and performance, our interconnect work, the telemetry we are doing, the power management work we’re doing, it really allows us to be prepared to bring that to the marketplace at scale to take advantage of this incredible computational capacity or intensity or capability that will exist in the marketplace.”
